@article{ ZHANG Jianhuaa:116, author = {ZHANG Jianhuaa,b,YUAN Fangb,ZHANG Jinsongb}, title = {Effect of Bonding Parameters and Chip/Substrate Thickness on Warpage of ChiponGlass Packaged with Nonconductive Film }, publisher = {Journal of Shanghai Jiao Tong University}, year = {2010}, journal = {Journal of Shanghai Jiaotong University}, volume = {44}, number = {01}, eid = {116}, numpages = {3}, pages = {116}, keywords = {nonconductive film (NCF); chiponglass (COG); chip; bonding; warpage}, url = {https://xuebao.sjtu.edu.cn/EN/abstract/article_39254.shtml}, doi = {} }

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